Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery.
Continued leadership in advanced 3D packaging innovations with Foveros Omni and Foveros Direct.
New node naming to create consistent framework, more accurate view of process nodes for customers and the industry as Intel enters the angstrom era of semiconductors.
https://www.intc.com/news-events/press-releases/detail/1486/intel-accelerates-process-and-packaging-innovations