MS估計25年底TSM CoWoS產能擴大到每月80,000片晶圓
MS says they see faster capacity expansion at TSMC in both the front-end (2nm/3nm) and advanced packaging (CoWoS) to meet very strong AI semi demand. MS notes “TSMC originally planned to expand CoWoS capacity to 80kwpm in 2026, but that now looks set to take place by end-2025. TSMC's AP8 fab (newly bought from Innolux) should offer sufficient space.” They now model TSMC's CoWoS capacity at 80k by 2025 and incremental allocation to Nvidia.