AMD討論POST(70) 睇#1&有時間幫手填資料

ZEN4年尾，預10-12月先會發佈

AMD and MediaTek Develop AMD RZ600 Series Wi-Fi 6E Modules to Enhance Laptop and Desktop PC Connectivity Experiences

To optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe® and USB interfaces for modern sleep states and power management, which are vital elements of modern customer experiences. Further, the optimization process included stress testing and ensuring compatibility standards, which may ultimately reduce development time for OEM customers.

https://corp.mediatek.com/news-events/press-releases/amd-and-mediatek-develop-amd-rz600-series-wi-fi-6e-modules-to-enhance-laptop-and-desktop-pc-connectivity-experiences

中間有冇話出個過渡款, 好似見到個2022Q1有出新野? 定係FOR LAPTOP

Zen3+ laptop 用ddr5

好似買ZEN 3+都唔錯, 等多2個月, 應該都係同ZEN 4差10%效能左右,部機屌唔住, 等有錢再升級, 同埋我玩D頹GAME

ZEN3+ APU應該只會出喺notebook
當然唔排除可能整Desktop版，當係提前為AM5主機板熱身

AM4最後就只有ZEN3 w/3D V-Cache
但就應該只有12/16核心先有

原有5000系應該會有XT版更新
但基本上可以忽略，提升微乎其微

呢個唔知有冇機會擠出嚟
兩個/多個CCX之間溝通都應該要有層LLC先好

反而想睇MCM package幾時升級做amd版emib
CDNA2已經見到用amd版emib嚟connect HBM同GCD
用emib做互聯, 相對傳統mcm節省好多電力同大大改善latency

見唔到amd上iod v-cache同emib都唔換cpu

要睇tsm 3d封裝技術

AVX-512的過去和CPU設計的未來 | 當代處理器設計的難題與解答

https://youtu.be/nguILUw_cOo

依家個AMD RADEON SOFTWARE終於都生性
好好用

58x真係好熱

各位用緊58x嘅巴打PBO用緊咩setting?
第一次用摸唔透點玩先有最好嘅efficiency

全核行緊4.6g 1.25v

hydra
pbo 太熱

4.6g 1.25v都熱？
諗住買個360 aio行pbo auto
頂兩年再過渡去自組水

一燒fpu就80度
用緊自組

平時鳩下鳩下pbo 都上7x
用hydra 未見過上70
燒機另計

咁咪算好
積熱唔上90 仲想點?

Minisforum EliteMini HM90 Mini PC With AMD Ryzen 9 4900H ‘Renoir’ APU Review

https://wccftech.com/review/minisforum-elitemini-hm90-mini-pc-with-amd-ryzen-9-4900h-renoir-apu-review/

要CES先發布3D V-cache Zen3即係冇二三月都唔會見街

11月量產左

只係epyc 先出

咁你都要堆好啲貨先出到貨又唔會（畀人做到）短缺架