TSMC Q4: 7nm Dominates Revenue, Preps 5nm Ramp, 6nm By
EOY
N6
Last year, TSMC announced the N6 node. This is an EUV-based node, but unlike N7+ which is entering its 2nd year of production, N6 is designed to be the easy migration path from N7 as its design rules are fully compatible with N7. In fact, TSMC considers N6 to be part of the “N7 family”. N6 is said to provide around 15-20% higher density with improved power consumption compared to N7, albeit no iso-power or speed comparisons where provided. We believe the density gains are obtained from switching from double diffusion breaks to a single isolation line. TSMC did note that N6 has 1 more EUV layer compared to N7+. TSMC reported that N6 is on track for risk production in the first quarter of this year with volume production expected before the end of the year. The 7 nm family is expected to continue to contribute more than 30% of wafer revenue in 2020.